摘要
利用超声辅助瞬态液相连接(超声-TLP)对Cu/Sn/Cu三明治结构进行钎焊试验,超声波的频率和功率分别为600W、20 kHz,焊接时加热温度为280℃,施加压力为0.06 MPa。在施加超声20 s后获得了全Cu_(3)Sn焊点,相比于传统TLP钎焊,大幅度提高了焊接效率;钎焊过程中,Cu_(3)Sn呈锯齿状,焊缝中Cu_(6)Sn_(5)为棒状或条状,最终转变成全Cu_(3)Sn焊点,且Cu_(3)Sn晶粒呈现出等轴晶形态。通过超声-TLP制备的全金属间化合物(IMC)焊点具有均匀的力学性能,其中Cu_(3)Sn相的杨氏模量和硬度分别为129.183.4.861 GPa,Cu_(6)Sn_(5)相的杨氏模量和硬度分别为127.586.6.110GPa。钎焊时间为2.8.20s获得的焊点剪切强度分别为31.8039.03.70.58 MPa,焊点的抗剪切强度随着焊缝中IMC的比例增加而增大。
The ultrasonic-assisted transient liquid phase soldering(ultrasound-TLP)was used to solder Cu/Sn/Cu sandwich structure.The frequency and power of the ultrasound were 600 W and 20 kHz respectively,the heating temperature was 280℃ during soldering,and the pressure was 0.06 MPa.Full Cu_(3)Sn solder joints were obtained after applying ultrasound for 20 s.Compared with that of traditional TLP soldering,the welding efficiency is greatly improved.During the soldering process,Cu_(3)Sn shows saw-toothed,Cu_(6)Sn_(5)/in the joint shows rod-like or strip-like and eventually turns into full Cu_(3)Sn,and the Cu_(3)Sn grains show equiaxed crystal.Full IMC solder joints soldered by ultrasound-TLP have uniform mechanical properties.The Young's modulus and hardness of Cu_(3)Sn are 129.183,4.861 GPa,respectively,and the Young's modulus and hardness of Cu_(6)Sn_(5) are 127.586,6.110 GPa,respectively.The shear strength of solder joints obtained at 2,8 and 20 s is 31.80,39.03 and 70.58 MPa,respectively.The shear strength of the solder joints increases as the proportion of intermetallic compounds in the weld increases.
作者
陈达龙
李晓延
韩旭
CHEN Dalong;LI Xiaoyan;HAN Xu(College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China)
出处
《热加工工艺》
北大核心
2022年第1期25-28,33,共5页
Hot Working Technology
