摘要
采用活性液体锡钎料阳极键合(ALTSAB)技术,选用SnAg3.5Ti2钎料,实现了可伐合金4J29与浮法玻璃的有效连接。研究了电压、温度对界面微观结构和剪切强度的影响,并探究了连接形成的机制。结果表明:随着电压和温度的升高,玻璃与钎料界面平直无显著变化,界面形成新的化学键≡Si-O-Ti和≡Si-O-Sn,发生氧化反应生成TiO、SnO;钎料与合金侧有反应溶解现象,可伐合金侧生成了FeSn_(2)相,钎料中分布着一些细长棒状和针状的Ni_(3)Sn_(4)相,分析认为:钠离子耗尽层的产生以及Ti^(2+)、Sn^(2+)向玻璃基体中的扩散是形成有效连接的关键。接头抗剪切强度随电压和温度的升高而增大,当电压为1000 V、温度为400℃时,最大抗剪切强度为12.5 MPa。
Effective connection between Kovar alloy 4J29 and float glass was realized using ALTSAB technology and SnAg3.5Ti2 solder.The effects of voltage and temperature on the interface microstructure and shear strength were studied,and the mechanism of bonding formation was explored.The results show that with the increase of voltage and temperature,the interface between glass and solder has no significant change,new chemical bonds≡Si-O-Ti and≡Si-O-Sn are formed at the interface,and TiO and SnO are formed by oxidation reaction.There is reaction dissolution phenomenon between solder and alloy side,and FeSn_(2) phase is formed at the Kovar alloy side.There are some slender rod-shaped and needle-like Ni_(3)Sn_(4) phases in the solder.It is considered that the formation of sodium ion depletion layer and the diffusion of Ti^(2+)and Sn^(2+)into the glass matrix are the key to the formation of effective bonding.The maximum shear strength is 12.5 MPa when the voltage is 1000 V and the temperature is 400℃.
作者
俞伟元
杨国庆
孙学敏
王锋锋
张涛
Yu Weiyuan;Yang Guoqing;Sun Xuemin;Wang Fengfeng;Zhang Tao(State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal,Lanzhou University of Technology,Lanzhou 730050,China)
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2021年第11期4003-4009,共7页
Rare Metal Materials and Engineering
基金
国家自然科学基金(52061023)。
