摘要
相比常规高多层背板而言,超长背板的尺寸稳定性较难控制,孔到线距离越来越小,层间对准度要求越高。文章主要介绍一种34层超长板的关键制作工艺,包括涨缩的管控,层间对准度的控制,背钻堵孔的改善,阻抗的控制等,为重点关键流程提供制作方法及解决方案。
Compared with the conventional high-multilayer backplane,the dimensional stability of super long backplane is more difficult to control.The distance from hole to line is smaller,and the inter-layer alignment is higher.This paper mainly introduces a key manufacturing process of a 34-layer super long size PCB and provides manufacturing methods and solution for it,which includes the control of expansion and contraction,the control of interlayer alignment,the improvement of blocking hole in backdrill process,and the control of impedance.
作者
唐成华
黄克强
黄建国
张长明
Tang Chenghua;Huang Keqiang;Huang Jianguo;Zhang Changming
出处
《印制电路信息》
2022年第1期56-61,共6页
Printed Circuit Information
关键词
超长板
背板
阻抗
背钻
Super Long Size PCB
Backplane
Impedance Control
Backdrill
