摘要
随着太阳能电池组件技术的发展,硅片尺寸逐步增大,大部分单晶电池组件额定工作电流较高,造成组件内损偏高,半片技术在应对内损有着突出优势。目前行业内普遍使用激光对单晶硅电池片进行对半切割。主要对激光的熔融法与热裂法在单晶硅电池片切割对比,以及两种方法切割的电池片组件机械可靠性研究和封装功率影响,探讨了熔融法与热裂法针对光伏晶硅电池片的优劣差异。在实际应用中对半片组件生产良率有一定参考意义。
With the development of solar cell module technology,the size of silicon wafer gradually increases.Most single crystal cell modules have high rated working current,resulting in high internal loss of modules.Half chip technology has outstanding advantages in dealing with internal loss.At present,laser is widely used in the industry to cut monocrystalline silicon cells in half.Aiming at the comparison of laser melting method and thermal cracking method on the cutting of monocrystalline silicon cells,the research on the mechanical reliability of cell modules cut by the two methods and the influence of packaging power,this paper discusses the advantages and disadvantages of melting method and thermal cracking method on photovoltaic crystalline silicon cells.In practical application,it has a certain reference significance for the production yield of half piece components.
作者
张姜飞
郭继霄
王燕飞
宋苏斌
杜成新
刘占雄
ZHANG Jing-fei;GUO Ji-xiao;WANG Yan-fei;SONG Su-bin;DU Cheng-xin;LIU Zhan-xiong(JA solar(Xingtai)Energy Company Limited,Xingtai,Hebei Province,054000,China)
出处
《电池工业》
CAS
2021年第6期300-302,共3页
Chinese Battery Industry
关键词
单晶硅电池片
激光切割
半片组件
机械可靠性
封装功率
monocrystalline silicon cell
laser cutting
half piece assembly
mechanical reliability
packaging power
