摘要
【目的】现代无线通信低频频谱资源越来越紧张,但太赫兹频段具有丰富的频谱资源,太赫兹通信兼具大带宽、高保密性等优势,故成为下一代无线通信技术的重要候选技术,而其关键在于太赫兹芯片。【方法】本文主要介绍太赫兹芯片技术及基于芯片的通信技术,对其从基于肖特基二极管芯片的混频、倍频分立式器件到太赫兹芯片的现有成果和未来发展趋势到未来太赫兹通信系统的技术发展和应用场景进行浅析。【结果】基于肖特基二极管的太赫兹分立器件如倍频器、混频器在不断朝高频段、大带宽以及高集成度发展。对芯片而言,基于磷化铟(InP)、砷化镓(GaAs)、氮化镓(GaN)、硅基技术的芯片都在朝着大功率、高频率、高集成度的方向发展,并且未来有望形成InP工艺和GaN工艺配合发展的格局。【结论】在未来,基于芯片技术的太赫兹通信系统可以朝向大规模频分复用、大规模MIMO技术、感通一体、光电融合,以及将频分、极化等多技术融合的复杂复用系统方向发展。我们也希望通过本综述来和读者探讨、畅想太赫兹芯片的发展趋势和基于太赫兹芯片技术的通信系统发展方向。
[Objective]With the increasing shortage of low-frequency spectrum resources in modern wireless communication,the terahertz band which is rich in spectrum resources and terahertz communication which has larger bandwidth and higher confidentiality have shown their advantage.It has become the key candidate of the next generation wireless communication technology with its core in terahertz chip.[Methods]This paper mainly introduces terahertz chip technology and chip-based communication technology.We will start from the key terahertz chips and devices,analyzing the existing achievements and future development trend of discrete devices based on Schottky diode chips,like mixer and frequency multiplier,to terahertz chips and consider the technical development trends and application scenario of the terahertz communication system in the future based on terahertz chip technology.[Results]Terahertz discrete devices based on Schottky diodes,such as frequency multiplier and mixer,are developing towards high frequency band,large bandwidth,and high integration.Regarding to terahertz chips,chips based on InP,GaAs,GaN,and silicon technology are developing towards high power,high frequency,and high integration,while it is expected to form a pattern of coordinated development of InP and GaN process in the future.[Conclusions]In the future,the terahertz communication system based on chip technology can develop towards large-scale frequency division multiplexing(FDM),large-scale MIMO,inductive communication integration,photoelectric fusion,and complex multiplexing system integrating technologies such as FDM and polarization multiplexing.We also hope to discuss and imagine the development trend of terahertz chips and the development direction of communication systems based on terahertz chip technology.
作者
曹浩一
董亚洲
王正
寇伟
张倩玉
童钦文
杨自强
龚森
曾泓鑫
张雅鑫
CAO Haoyi;DONG Yazhou;WANG Zheng;KOU Wei;ZHANG Qianyu;TONG Qinwen;YANG Ziqiang;GONG Sen;ZENG Hongxin;ZHANG Yaxin(University of Electronic Science and Technology of China,Chengdu,Sichuan 611731,China;Yangtze Delta Region Institute(Huzhou),University of Electronic Science and Technology of China,Huzhou,Zhejiang 313099,China)
出处
《数据与计算发展前沿》
CSCD
2021年第5期82-97,共16页
Frontiers of Data & Computing
关键词
太赫兹通信
太赫兹芯片
太赫兹通信系统
频分复用
大规模MIMO
感通一体
光电融合
复杂复用系统
Terahertz communication
Terahertz chip
Terahertz communication system
Frequency division multiplexing(FDM)
Large-scale MIMO
Inductive communication integration
Photoelectric fusion
Complex multiplexing system
