摘要
相比传统的Sn-Pb钎料,In基钎料由于相对较低的熔点、适用于镀Au层上的焊接以及优越的抗热疲劳性能等优点,可满足高可靠电子组件中多温度梯度的焊接需求。综述并介绍了典型In基钎料的润湿性能、微观组织以及焊点力学性能特点。
Compared with the traditional Sn-Pb solder,Indium-based solder can meet the soldering requirements of multiple step-soldering process in highly reliable electronic components due to its low melting point temperature,reduction in the rate of dissolution of gold coatings and excellent thermal mechanical properties.The wettability,microstructure,mechanical properties of the typical In-based solder joints are reviewed and introduced.
作者
皋利利
王莹
赵猛
王晓蓉
朱昳赟
GAO Lili;WANG Ying;ZHAO Meng;WANG Xiaorong;ZHU Yiyun(Shanghai Radio Equipment Research Institute,Shanghai 201109,China;Shanghai Academy of Spaceflight Technology,Shanghai 201109,China)
出处
《电子工艺技术》
2021年第6期311-315,323,共6页
Electronics Process Technology
基金
国防科工局“双百”项目。
关键词
In基钎料
梯度焊接
组织与性能
焊点可靠性
indium-based solder
step-soldering
microstructure and property
solder joint reliability
