摘要
以双环戊二烯酚型环氧树脂(DCPDEP)、双酚A型氰酸酯树脂(CE)、联苯型液晶环氧树脂为基体树脂,KH-560为偶联剂,马来酸酐化聚丁二烯(MLPB)为增韧剂,硅微粉和两种不同粒径的六方氮化硼为填料,制备了覆铜板,通过介电性能及导热性能测试研究了树脂含量及填料与树脂配比对体系性能的影响。结果表明:当树脂中DCPDEP质量分数为57%,CE质量分数为24%,液晶环氧树脂质量分数为19%,填料用量为树脂质量的1.4倍,其中硅微粉、1~2μm的六方氮化硼与3~5μm的六方氮化硼的质量比为3∶1∶2时,制得的覆铜板综合性能良好。1 GHz下的介电常数为3.335,介电损耗为0.007 4,导热系数为1.21 W/(m·K),剥离强度为0.6 N/mm,耐压强度大于2 kV,耐热测试无起泡分层现象。
The copper clad laminates were prepared using dicyclopentadiene phenol epoxy resin(DCPDEP),bisphenol A cyanate ester resin(CE)and biphenyl liquid crystal epoxy resin as matrix resin,KH-560 as coupling agent,maleic anhydride polybutadiene(MLPB)as toughening agent,silicon powder and two kinds of hexagonal boron nitride with different particle diameters as fillers. The effects of resin content and the ratio of filler to resin on the properties of the system were studied by testings of dielectric properties and thermal conductivity. The results showed that when the mass fraction of DCPDEP,CE and liquid crystal epoxy resin in the resin was 57%,24%and 19%,respectively,the amount of filler was 1.4 times of the resin mass,and the mass ratio of silicon micropowder,1~2 μm hexagonal nitride boron and 3~5 μm hexagonal boron nitride was 3 ∶ 1 ∶ 2,the overall performance of the prepared copper clad laminate was good.The dielectric constant and dielectric loss at 1 GHz was 3.335 and 0.007 4,respectively.The thermal conductivity was 1.21 W/(m·K).The peel strength was 0.6 N/mm. The compressive strength was greater than 2 kV,and there was no blistering and delamination in the heat test.
作者
焦永斌
秦会斌
周继军
JIAO Yong-bin;QIN Hui-bin;ZHOU Ji-jun(Institute of New Electron Device&Application,Hangzhou Dianzi University,Hangzhou 310018,China)
出处
《热固性树脂》
CAS
CSCD
北大核心
2021年第5期43-47,共5页
Thermosetting Resin
基金
浙江省科技计划项目(2017C01027)。
关键词
覆铜板
高频
高导热
介电性能
双环戊二烯酚型环氧树脂
双酚A型氰酸酯树脂
联苯型液晶环氧树脂
六方氮化硼
copper clad laminate
high frequency
high thermal conductivity
dielectric property
dicyclopentadiene phenol epoxy resin
bisphenol A cyanate ester resin
biphenyl liquid crystal epoxy resin
hexagonal boron nitride
