摘要
近年来,以嵌入式微流体液冷散热技术为代表的主动热管理因其优异的散热性能而被广泛研究。然而,嵌入式微流体液冷散热技术常使用体积较大的外置泵、阀等构成流体回路,以致该技术难以应用于现有的射频微系统。该文提出了一种集成压电微泵阵列的一体化自闭环微系统热管理方法,并完成了该微系统样机的设计与研制。在常温、高温与低温环境下分别对该微系统样机供液流量及散热性能进行了测试。常温测试结果表明,在芯片热流密度为250.9 W/cm^(2)时,芯片表面温升能控制在56℃以下,而集成的2×2压电微泵阵列实现了高达57 mL/min的供液流量。该技术可用于解决高功率射频微系统的高效一体化热管理问题。
Recently,advanced thermal management technologies represented by the embedded cooling technique have been widely investigated and demonstrated as a promising approach to solve the problem of the thermal management for microsystems.However,the embedded cooling technology needs to be combined with large fluidic components such as pumps and valves to form a fluidic loop,which makes it difficult to apply to the RF microsystems.This paper proposes an autonomous closed-loop thermal management technique based on integrated piezoelectric micropumps,and the prototype has been designed and fabricated.The cooling performance of the prototype was tested under room temperature,high temperature and low temperature environment,respectively.Experimental results show that the temperature rise of the chip surface can be controlled below 56℃when the chip-level heat flux is 250.9 W/cm^(2),and the 2×2 piezoelectric micropump array achieves a liquid flow rate up to 57 mL/min.The proposed technology can be used to solve the problem of the thermal management for the high-power RF microsystems.
作者
余怀强
杜建宇
刘雨陇
陈星
邓立科
张磊
王玮
YU Huaiqiang;DU Jianyu;LIU Yulong;CHEN Xing;DENG Like;ZHANG Lei;WANG Wei(The 26th Research Institute of China Electronics Technology Group Corporation,Chongqing 400060,China;School of Engineering and Technology,China University of Geosciences(Beijing),Beijing 100083,China;School of Integrated Circuits,Peking University,Beijing 100091,China)
出处
《压电与声光》
CAS
北大核心
2021年第5期676-679,共4页
Piezoelectrics & Acoustooptics
关键词
热管理
微系统
压电微泵
热流密度
内嵌微通道
thermal management
microsystem
piezoelectric pump
heat flux
embedded microchannel
