摘要
研究了一种用于PCB铜表面处理的全新耐高温有机物可焊保护剂(HT-OSP),它以2−[(2,4−二氯苯基)甲基]−1H−苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))为主要成分,溶液稳定性好,能在金属铜表面形成有机膜,避免铜面出现氧化、异色等现象。考察了各种因素对HT-OSP薄膜层厚度的影响,并根据抗氧化性、耐高温热稳定性等测试来判断HT-OSP薄膜对PCB表面的处理效果。对于含有4.5 g/L C_(14)H_(10)Cl_(2)N_(2)、3.5 mol/L有机酸、3 g/L长链酸及0.5 g/L金属盐的HT-OSP溶液,当其pH为3.0时,在45°C下对PCB处理75 s可获得最佳效果。
A novel high-temperature-resistant organic solderability preservative(HT-OSP)for treating PCB surface was developed,which is mainly composed of 2-[(2,4-dichlorophenyl)methyl]-1H-benzimidazole(C_(14)H_(10)Cl_(2)N_(2))and has excellent stability in solution.The organic film formed therewith on copper surface eliminates the oxidation and discoloration of copper.The factors affecting the thickness of HT-OSP film were studied.The protection effectiveness of PCB surface by being treated with HT-OSP was assessed through antioxidation test and high-temperature stability test.The HT-OSP solution comprising C_(14)H_(10)Cl_(2)N_(2)4.5 g/L,organic acid 3.5 mol/L,long-chain acid 3 g/L,and metal salt 0.5 g/L has the best performance when treating PCB at temperature 45°C and pH 3.0 for 75 seconds.
作者
缪桦
王玲凤
何为
李玖娟
邹文中
周国云
王守绪
叶晓菁
朱凯
MIAO Hua;WANG Lingfeng;HE Wei;LI Jiujuan;ZOU Wenzhong;ZHOU Guoyun;WANG Shouxu;YE Xiaojing;ZHU Kai(Shennan Circuit Co.,Ltd.,Shenzhen 518023,China;School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 610054,China)
出处
《电镀与涂饰》
CAS
北大核心
2021年第15期1193-1199,共7页
Electroplating & Finishing
关键词
印制电路板
有机可焊保护剂
咪唑类化合物
铜
表面处理
高温稳定性
printed circuit board
organic solderability preservative
imidazole compound
copper
surface treatment
high temperature stability
