摘要
在复合材料胶接工艺试验中发现,二次胶接试样的力学性能与基板存储时间有关,本文针对该现象开展研究。选择典型的复合材料基材开展试验,采用I型层间断裂韧性(GIC)进行力学性能表征,确认基材吸湿是导致胶接性能大幅下降的主要原因。在此基础上,开展待胶接基材吸湿对胶接性能的影响研究,掌握了典型基材吸湿对胶接性能的影响。根据试验结果,开展了吸湿影响机理探索,具体内容为,固化后基材在室温下发生吸湿,基材吸收的水分在胶接固化过程中释放,水分与胶膜发生物理化学作用,包括将基材与胶膜隔离、使胶膜内部产生孔隙或孔洞、对胶膜产生塑化作用以及降低玻璃化转变温度,从而导致胶膜强度降低、胶接性能大幅下降。
In the bonding process test of composite materials,it is found that the mechanical properties of the second-bonding samples are related to the substrate storage time,and this phenomenon is studied in this paper.By selecting typical composite substrate to carry out experiments,and using Mode I interlaminar Fracture Toughness(GIC)to characterize the mechanical properties,it is confirmed that the moisture absorption of the substrate is the main reason leading to the sharp decline of the bonding properties.On this basis,the influence of moisture absorption of the substrate to be bonded on the bonding performance was studied,and the influence of moisture absorption of the typical substrate on the bonding performance was mastered.According to the test results,the mechanism of hygroscopic influence was explored.Specifically,after curing,the substrate absorbed at room temperature,the moisture absorbed by the substrate is released during the bonding and curing process,and the physical and chemical interaction between moisture and the film occurs:Including the isolation of the substrate and the film,the film internal pores or holes,plasticization of the film,reduce the glass transition temperature,resulting in a reduction in film strength,bonding performance significantly decreased.
作者
余永波
晏冬秀
陈萍
YU Yongbo;YAN Dongxiu;CHEN Ping(COMAC Shanghai Aircraft Manufacturing Co.,Ltd.,Shanghai 201324)
出处
《纤维复合材料》
CAS
2021年第2期34-38,共5页
Fiber Composites
关键词
二次胶接
吸湿
胶膜
层间断裂韧性
影响机理
second-bonding
absorbed water
adhesive film
interlaminar fracture toughness
influence mechanism
