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高分子异氰酸酯胶粘剂的固化过程与性能评价研究 被引量:2

Study on the Curing Process and Property Evaluation of Polymer Isocyanate Adhesive
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摘要 高分子异氰酸酯胶粘剂固化过程中的反应会对其结构造成影响,为此研究高分子异氰酸酯胶粘剂的固化过程与性能评价,降低其固化反应影响。采用双酚A二缩水甘油醚(E-51)和二苯甲烷二异氰酸酯(MDI)为主要原料制备高分子异氰酸酯胶粘剂样品,通过红外光谱仪和差式扫描量热仪分析其在不同固化温度下的固化反应,评价其黏度、剪切性能、T剥离强度以及固化时间。固化过程分析结果表明:胶粘剂样品分别在52℃、106℃、263℃三个固化温度下,出现放热峰峰值;固化温度低于150℃、205℃、240℃时,胶粘剂样品呈现三种结构,分别为异氰脲酸酯、恶唑烷酮和恶唑烷酮结构。力学性能评价结果显示,固化温度越高,胶粘剂样品的黏度和剪切强度越好,固化温度达到205℃以上,试样的T剥离强度先增加后减小,在R=1.4时达到最高T剥离强度145.6N/25mm,选择184∶TPO为2∶1时光引发效果较好。 The reaction of the polymer isocyanate adhesive will affect its structure during the curing process,therefore,the curing process and performance evaluation of the adhesive are studied to reduce the effect caused by the curing reaction.The samples of high molecular isocyanate adhe-sive are prepared from bisphenol A diglycidyl ether(E-51)and diphenylmethane diisocyanate(MDI).The curing reactions of the adhesive at different temperature are analyzed with the infrared spectrometer and differential scanning calorimeter,and its viscosity,shear performance,T peel strength and curing time are evaluated.The results of the curing process show that the top of the exothermic peak appears at 52℃,106℃and 263℃,respectively;when the curing temperature is lower than 150℃,205℃and 240℃,the adhesive samples exhibit three kinds of structures,which is isocyanurate,oxazolidone and oxazolidone structures respectively.The results of mechanical properties evaluation show that the higher the curing temperature is,the better the viscosity and shear strength of the adhesive sample is,when the curing temperature is above 205℃,the T peel strength of the sample increases firstly and then decreases,and the maximum T peel strength is 145.6 N/25 mm when the R=1.4,and the initial effect is better when the ratio of 184∶TPO is selected as 2∶1.
作者 高燕 GAO Yan(Energy Research Institute of Chemical Industry,Xianyang Vocational and Technical College,Xianyang 712000,China)
出处 《化学与粘合》 CAS 2021年第4期279-283,共5页 Chemistry and Adhesion
关键词 高分子 异氰酸酯 胶粘剂 固化过程 性能评价 放热峰顶峰 Polymer isocyanate adhesive curing process performance evaluation top of the exothermic peak
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