摘要
化学机械抛光机是加工光学元件的主要设备,抛光盘面形是影响抛光机加工精度的重要技术参数。现有的抛光盘面形测量主要依赖离线测量的方式,存在着测量基准不统一、二次装夹引发变形等问题。针对上述问题,提出了一种抛光盘面形在位测量方法,搭建了抛光盘面形在位测量系统。经过误差分析将测量误差分离成为平行度误差与直线度误差两部分,通过垫调整片的方式将平行度误差从0.043 mm减小到0.015 mm,再通过z向补偿的方式将测量误差进一步减小到0.006 mm。分别利用抛光盘面形在位测量系统和三坐标测量机对直径200 mm的检测件进行了测量,两种测量方式的结果显示:抛光盘面形在位测量系统的测量误差在0.003 mm之内。抛光盘面形在位测量系统的测量精度得到了有效验证。
Chemical mechanical polishing machine is the prevailing equipment for processing optical components,and surface shape of polishing pad is a crucial technical parameter affecting the machining accuracy of the polishing machine.The current surface shape measurement of polishing pad surface shape mainly relies on off-line measurement,which results in some problems,for instance,inconsistent measurement datum and deformation caused by secondary clamping.In order to solve the above problems,a method of in-situ measurement of polishing pad surface shape is proposed,and a measurement system for polishing pad surface shape is built.Through error analysis,the measurement error is divided into parallelism error and straightness error.The parallelism error is reduced from 0.043 mm to 0.015 mm by adjusting plate,and the measurement error is further reduced to 0.006 mm by Z-direction compensation.The measurement of a workpiece with diameter of 200 mm was carried out by using the in-situ measurement system for polishing pad surface shape and the CMM.Comparing the results of the two measurement methods,it could be concluded that the measurement error of the in-situ measurement system for polishing pad surface shape is within 0.003 mm.The measurement precision is fully verified.
作者
马堃
金洙吉
董志刚
朱祥龙
康仁科
MA Kun;JIN Zhu-ji;Dong Zhi-gang;ZHU Xiang-long;KANG Ren-ke(Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian Liaoning 116024,China)
出处
《组合机床与自动化加工技术》
北大核心
2021年第6期49-52,共4页
Modular Machine Tool & Automatic Manufacturing Technique
基金
国家重点研发计划项目(2016YFB1102205)
国家自然基金重大项目(51991372)
国家自然基金面上项目(51775084)。
关键词
化学机械抛光
抛光盘面形
在位测量
chemical mechanical polishing
polishing pad surface shape
in-situ measurement
