摘要
氮化硼(BN)是一种无机陶瓷材料,耐高温、耐化学腐蚀,性能优异。六方氮化硼(hBN)还具有优异的介电性、导热性及独特的二维层状结构,其作为导热材料制备的复合材料在电子信息等领域得到了广泛应用,但聚合物基复合材料从制备到终端产品的产业化仍然是工业界和学术界面临的巨大挑战。综述了六方氮化硼的制备和六方氮化硼/聚合物导热复合材料的研究现状,并对其应用前景进行了展望。
Boron nitride(BN)is an inorganic ceramic material that is resistant to high temperature and chemical corrosion and has excellent performance.Hexagonal boron nitride(hBN)also has excellent dielectric properties,thermal conductivity and a unique two-dimensional layered structure.It is widely used as a composite material made of thermally conductive materials in electronic information and other fields.However,the industrialization of polymer matrix composites from preparation to end products is still a huge challenge facing industry and academia.The preparation of hexagonal boron nitride and the current research status of hexagonal boron nitride/polymer thermally conductive composites are reviewed,and suggestions are made for its prospect development.
作者
南钰
陈厚振
郑罡
宋瑞卿
冯明
秦泽华
NAN Yu;CHEN Houzhen;ZHEN Gang;SONG Ruiqing;FENG Ming;QIN Zehua(Kaifeng Power Supply Company,State Grid Henan Electric Power Company,Kaifeng 475000,China;School of Textiles,Zhongyuan University of Technology,Zhengzhou 450007,China)
出处
《中原工学院学报》
CAS
2021年第2期17-24,共8页
Journal of Zhongyuan University of Technology
基金
国网河南省电力公司科技项目(521790200018)
2021年度河南省高等学校重点科研项目(21A430047)。
关键词
六方氮化硼
聚合物
导热
hexagonal boron nitride
polymer
thermal conductivity
