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一种高黏共挤抗静电保护膜的制备及其应用研究

Study on the Preparation and Application of a High-viscosity Co-extrusion Antistatic Protective Film
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摘要 以新型离子液体型抗静电剂对热熔性压敏胶进行抗静电改性,将改性后的热熔性压敏胶与LDPE基材通过三层共挤吹膜成型高黏共挤抗静电保护膜,研究了离子液体含量与热熔性压敏胶的加工性能、高黏共挤抗静电保护膜表面电性能、力学性能之间的定量关系。结果表明,离子液体的加入,可以明显的降低高黏共挤保护膜的表面电阻,在离子液体含量为4%时,表面电阻为(1.0~9.9)×10^(10)Ω/□,撕膜电压小于200 V;离子液体对热熔性压敏胶具有较好的增塑作用,离子液体对高黏共挤保护膜的力学强度(如180°剥离强度、拉伸强度)无明显的影响。研究的高黏共挤抗静电保护膜在电子产品制造领域有较大应用前景。 In this study,a new type of ionic liquid antistatic agent was employed to antistatic modification on the hot melt pressure-sensitive adhesive.The modified hot melt pressure-sensitive adhesive and low density polyethylene(LDPE)base material were processed by a 3-layer co-extrusion blown technique to form a high-viscosity co-extrusion antistatic film.The quantitative relationship among the content of the ionic liquid and the processing,electrical and mechanical properties of the high-viscosity co-extrusion film was studied.The results show that the addition of ionic liquid can significantly reduce the surface resistance of the protective film.When the ionic liquid content is 4%,the surface resistance is(1.0~9.9)×10^(10)Ω/square,and the peeling voltage is less than 200 V.The ionic liquid has good plasticizing effect on the hot melt pressure-sensitive adhesive,and has no obvious effect on the mechanical strength(such as 180°peeling strength and tensile strength)of the protective film.The protective film has great application prospects in the field of electronic product manufacturing.
作者 万兆荣 吕冬 汪加胜 杜壮 胡优 杨晶磊 WAN Zhao-rong;LÜDong;WANG Jia-sheng;DU Zhuang;HU You;YANG Jing-lei(Guangzhou HKUST Fok Ying Tung Research Institute,Guangzhou 511458,China;Guangzhou Lushan New Materials Co.,Ltd.,Guangzhou 510700,China;Department of Mechanical and Aerospace Engineering,The Hong Kong University of Science and Technology,Hong Kong,China)
出处 《塑料工业》 CAS CSCD 北大核心 2021年第4期174-178,共5页 China Plastics Industry
基金 广州市科技计划项目(201907010024) 广州开发区国际科技合作项目(2018GH04) 佛山科大专项(FSUST19-FYTRI02)。
关键词 抗静电 离子液体 热熔性压敏胶 共挤 电子产品保护膜 Antistatic Ionic Liquid Hot Melt Pressure-Sensitive Adhesive Co-extrusion Protective Film for Electronic Products
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