摘要
传统方案将单体式二维MEMS(Micro-Electro-Mechanical System)微镜作为扫描结构,但其制造工艺复杂且在工作过程中存在失效率高的问题。鉴于此,将成本更低廉的两个一维静电式MEMS微镜进行封装组合以得到二维扫描器件模块,通过对器件的设计和制造工艺的研究,最终研制出MEMS二维扫描器件模块,整个器件模块具有结构紧凑、制造工艺简单、成本低、可靠性高且易于批量制造的优点。实验结果表明,MEMS二维扫描器件模块在X轴方向的扫描光学角度可达48.0°(驱动频率为28.25 kHz,电压160 V),在Y轴方向的扫描光学角度可达12.5°(驱动频率为3.80 kHz,电压为160 V),光学性能可媲美单体式二维MEMS微镜,满足微型激光投影领域的使用需求。
The traditional solution uses a single two-dimensional MEMS(Micro-Electro-Mechanical System)micromirror as the scanning structure,but its manufacturing process is complicated and there is a problem of high failure rate in the working process. In view of this,two cheaper one-dimensional electrostatic MEMS micromirrors are packaged and combined to obtain a two-dimensional scanning device module. Through the research of device design and manufacturing process,a MEMS two-dimensional scanning device model is finally developed. The entire device module has the advantages of compact structure,simple manufacturing process,low cost,high reliability and easy mass manufacturing. Experimental results show that the scanning optical angle of the MEMS two-dimensional scanning device module in the X-axis direction can reach 48. 0°(driving frequency is 28. 25 k Hz,voltage is 160 V),and the scanning optical angle in the Y-axis direction can reach 12. 5°(driving frequency is 3. 80 k Hz,voltage is160 V),and its optical performance is comparable to that of a single two-dimensional MEMS micromirror,which can meet the needs of the field of micro laser projection.
作者
程进
周顺
徐乃涛
陆安江
刘卫国
Cheng Jin;Zhou Shun;Xu Naitao;Lu Anjiang;Liu Weiguo(School of Photoelectric Engineering,Xi'an Technological University,Xi'an,Shaanxi 710021,China;China Key System&Integrated Circuit Co.,Ltd,Wuxi,Jiangsu 214101,China;College of Big Data and Information Engineering,Guizhou University,Guiyang,Guizhou 550025,China)
出处
《激光与光电子学进展》
CSCD
北大核心
2021年第1期275-280,共6页
Laser & Optoelectronics Progress
基金
国防基础科研项目(JCKY2016208A002)
贵阳国家高新技术产业开发区高层次人才项目。
关键词
光学器件
MEMS微镜
激光投影
二维扫描
集成封装
optical devices
MEMS micromirror
laser projector
two-dimensional scanning
integrated packaging
