摘要
利用微波等离子体化学气相沉积法(MPCVD),在CH4/H2体系下沉积金刚石膜,通过发射光谱仪测量等离子体参数,结合Raman光谱仪测量金刚石膜的内应力,用SEM测试金刚石膜的表面以及断面形貌,通过热震试验来探究钨表面激光处理对金刚石膜附着力的影响。结果表明:钨片表面激光处理能释放金刚石膜的应力,增强钨片与金刚石膜的附着力;在确保钨与金刚石膜附着力得到极大提高与钨片表面损伤尽量小的前提下,钨片表面切割深度在0.035 mm时较合适。
Diamond film is deposited in CH4/H2 system by microwave plasma chemical vapor deposition(MPCVD).Plasma parameters are measured by emission spectrometer.The internal stress of the grown diamond film is measured by Raman spectrometer.The surface and section morphology of the grown diamond film are measured by SEM.The influence of tungsten surface laser treatment on the adhesion of diamond film is explored through thermal shock test.The results show that laser treatment can release the stress of diamond film and enhance the adhesion between tungsten and diamond film;with the premise that the adhesion between tungsten and diamond film is greatly improved and the surface damage of tungsten slice is as small as possible,the cutting depth of tungsten slice surface is more appropriate at 0.035 mm.
作者
黄逸豪
马志斌
HUANG Yihao;MA Zhibin(Key Laboratory of Plasma Chemical and Advanced Materials of Hubei Province, School of Materials Science and Engineering, Wuhan Institute of Technology, Wuhan 430073, China;School of Chemistry and Chemical Engineering, Huanggang Normal College, Huanggang 438000, Hubei, China)
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2021年第1期17-20,共4页
Diamond & Abrasives Engineering
