摘要
碳纤维增强碳化硅陶瓷基(C/SiC)复合材料由于其强度高、硬度大、耐磨损,被广泛应用于工业、航空航天等领域,然而C/SiC复合材料难以被稳定地去除加工。本文综述C/SiC复合材料的常见制备方式及其材料的性能特点。概述C/SiC复合材料的传统机械加工、超声辅助加工、激光加工等加工方法,分析了各种加工方法的材料去除机理、加工精度、常见缺陷及加工过程中存在的问题。传统的机械加工需进一步优选切削刀具材料;超声辅助加工需探究超声振动的刀具与材料之间的耦合作用机制、振动作用下的材料去除机理;激光加工要进一步研究2.5维及3维C/SiC复合材料的激光加工去除机理。在这些研究的基础上进一步采用复合加工的方法,探寻C/SiC复合材料高效、精密、稳定和无损加工的可能性。
Carbon fiber reinforced silicon carbide ceramic based(C/SiC)composites are widely used in industrial,aerospace and other fields due to their high strength,hardness and wear resistance.However,C/SiC composites are difficult to be removed and processed.In this paper the common preparation methods of C/SiC composites and the performance characteristics of their materials are reviewed.The traditional machining methods,ultrasonic assisted machining,laser processing and other processing methods of C/SiC composites are summarized.The material removal mechanism,processing precision,common defects and problems in the processing are analyzed.Traditional machining needs further optimization cutting tool materials.Ultrasonic assisted machining needs to explore the coupling mechanism of ultrasonic vibration between the tool and the material,and the mechanism of material removal under vibration.The removal mechanism of 2.5-dimensional and 3-dimensional C/SiC composites by laser processing also needs to be studied.On the basis of these studies,the possibility of high efficiency,precision,stability and non-destructive processing of C/SiC composite materials is explored by further adopting the composite machining method.
作者
焦浩文
陈冰
左彬
JIAO Haowen;CHEN Bing;ZUO Bin(Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material,Intelligent Manufacturing Institute,Hunan University of Science and Technology,Xiangtan 411201,Hunan,China)
出处
《航空材料学报》
EI
CAS
CSCD
北大核心
2021年第1期19-34,共16页
Journal of Aeronautical Materials
基金
国家自然科学基金(51705148)
湖南省自然科学基金(2018JJ3165)。
关键词
C/SIC复合材料
制备方式
传统机械加工
超声辅助加工
激光加工
C/SiC composite
preparation method
traditional mechanical processing
ultrasonic assisted processing
laser processing
