摘要
The hot isostatic pressing-diffusion bonding(HIP-DB)was proposed to achieve the joining of CuAgZn and GH909 directly without an interlayer.The microstructure of joint was characterized by scanning electron microscope(SEM),energy dispersive spectrometer(EDS)and X-ray diffraction(XRD).The microhardness and shear strength were tested to investigate the mechanical properties of joint.The results showed that the interface was complete,and the joint was compact,uniform and free of unbonded defects.The maximum microhardness of joint was HV 443,higher than that of two base alloys,and the average shear strength of joint reached 172 MPa.It is concluded that a good metallurgical bonding between CuAgZn and GH909 can be obtained by HIP-DB with the process parameters of 700℃,150 MPa and 3 h.
通过热等静压−扩散连接工艺直接连接CuAgZn和GH909,利用扫描电镜(SEM)、能谱仪(EDS)和X射线衍射仪(XRD)观察接头的显微组织和成分,并通过测试显微硬度和剪切强度研究接头的力学性能。结果表明,CuAgZn/GH909结合界面紧密完整,接头密实、均匀,无未连接的缺陷。接头的最大显微硬度为HV 443,高于两种基体合金,平均剪切强度高达172 MPa。由此得出,CuAgZn和GH909两种合金通过热等静压−扩散连接工艺在700℃、150 MPa和3 h的参数下可以实现良好的冶金结合。
基金
The authors are grateful for the financial support from the Advanced Space Propulsion Technology Laboratory Open Fund,China(LabASP-2018-16).
