摘要
高质量的表面加工是金刚石体块和薄膜生长以及器件制备的关键。本实验利用激光切割块状HTHP金刚石,并采用激光共聚显微镜(LEXT)、拉曼光谱(Raman)及X射线光电子谱(XPS)、电子背散射衍射(EBSD)分析金刚石的表面形貌、抛光过程中表面状态的转化情况,以及抛光后金刚石的表面损伤及结晶质量。经过机械抛光和化学机械抛光,激光切割带来的表面碳化层和损伤层被有效去除,金刚石的表面粗糙度达到0.764 nm。进一步地,通过微波等离子体化学气相沉积(MPCVD)法在HTHP金刚石籽晶上沉积同质薄膜材料,获得生长条纹规则、低应力、拉曼半宽2.1 cm-1、XRD半宽仅为87arcsec的高质量金刚石薄膜。
High quality surface processing is the key to diamond bulk and film growth and device fabrication. In this paper, laser-cut HTHP diamond was used, and the surface morphology of diamond after laser cutting was analyzed by Laser Confocal Microscopes(LEXT), Raman spectroscopy(Raman), X-ray photoelectron spectroscopy(XPS) and electron backscatter diffraction(EBSD), the transformation of the state during the polishing process, as well as the surface damage and crystal quality of the polished diamond. After two steps of mechanical polishing and chemical mechanical polishing, the carbonized layer and the damaged layer of the diamond surface are effectively removed by laser cutting, and the surface roughness reaches 0.764 nm. Further, a homogeneous thin film material is deposited on the HTHP diamond seed by a microwave plasma chemical vapor deposition(MPCVD) method to obtain a growth fringe rule, a low stress, a Raman half width of 2.1 cm^(-1), and a XRD half width of only 87 arcsec. High quality diamond film.
作者
段鹏
彭燕
王希玮
韩晓桐
王笃福
胡小波
徐现刚
DUAN Peng;PENG Yan;WANG Xiwei;HAN Xiaotong;WANG Dufu;HU Xiaobo;XU Xiangang(State Key Laboratory of Crystal Materials,Shandong University;Jinan Diamond Technology Co.,Ltd.,Jinan 250000,Shandong,China)
出处
《材料导报》
EI
CAS
CSCD
北大核心
2021年第4期4034-4037,4041,共5页
Materials Reports
基金
国家重点研发计划(2018YFB0406501)
山东省自然科学基金重大基础研究项目(ZR2017ZA0101)
山东省重点研发计划(2016ZDJS01B03)
晶体材料国家重点实验室自主课题。
