摘要
金刚石/铜复合材料具有密度低、强度高及热膨胀系数可调等优点,但金刚石与铜的润湿性差,界面热阻大,导致金刚石/铜复合材料热导率低。文中以铜镍合金为基体,采用放电等离子烧结工艺制备金刚石/铜复合材料,研究Ni的质量分数和混粉方式对金刚石/铜复合材料组织和热物理性能的影响。结果表明:随着Ni元素质量分数的增加,金刚石/铜复合材料的热导率先增大后减小,当Ni的质量分数为0.5%时,热导率最高为210:63 W/(m·K),且金刚石在Cu基体中分散均匀,界面结合较紧密,说明Ni元素的加入对改善金刚石和Cu之间的润湿性有明显的促进作用,而对其力学性能影响不大;在混粉方式方面,普通球磨方式下试样的热导率最高达到244:91 W/(m·K),无磨球混粉和球磨后热处理方式下试样的维氏硬度达到了200,比普通球磨方式下的硬度高出32.5%。
The diamond/copper matrix composites have the advantages of low density,high thermal conductivity and adjustable thermal expansion coefficient,but poor wettability and high thermal resistance at the interface between diamond and copper lead to low thermal conductivity of the composites.In this paper diamond/Cu-Ni composites are prepared by spark plasma sintering and using Cu-Ni alloy as the matrix.The effects of Ni content and powder mixing methods on the microstructure and thermo-physical properties of diamond/Cu-Ni composites are studied.The results show that the thermal conductivity of the diamond/Cu-Ni composite first increases and then decreases as increase of Ni content.When the mass fraction of Ni is 0.5%,the thermal conductivity reaches the maximum of 210:63 W/(m·K).The diamond particles disperse evenly in the Cu matrix and the interface between diamond and copper is closely combined.All these demonstrate that Ni element can obviously improve the wettability between diamond and copper,while the content of Ni had little impact on the mechanical properties of the composites.Among the different process of mixing powder,the maximum thermal conductivity of the sample is 244:91 W/(m·K)for ordinary mixing powder with grinding ball,and the hardness of the sample can reach 200 for mixing powder without grinding ball and for mixing powder with heat treatment after grinding ball,which is 32.5% higher than that of ordinary mixing powder with grinding ball.
作者
李宏钊
王长瑞
陈明和
王宁
李治佑
唐丽娜
LI Hongzhao;WANG Changrui;CHEN Minghe;WANG Ning;LI Zhiyou;TANG Lina(National Key Laboratory of Science and Technology on Helicopter Transmission,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;Shanghai Aerospace Equipment Manufacturer Co.,Ltd.,Shanghai 200245,China)
出处
《电子机械工程》
2021年第1期44-48,共5页
Electro-Mechanical Engineering
基金
国家自然科学基金资助项目(52075250)
直升机传动技术重点实验室开放课题项目(HTL-O-19G09)。
