摘要
集成电路(IC)产业是信息技术产业的核心,也是重庆以"芯屏器核网"为核心的电子信息支柱产业。重庆市以创新为引领加速产业转型,聚焦IC产业的创新发展,迫切需要产业链与创新链的高效协同。文章将IC产业链分为IC设计、芯片制造、芯片封装、成品测试四个核心环节,围绕科技人才、科研机构、研发平台、科技成果、科技企业、科研项目六个创新链关键要素进行了系统性分析。在重庆市IC产业现状的基础上,提炼了创新链中仍然面临的问题,提出了进一步强化产业创新链的建议。
The IC industry is the core of the information technology industry, and also one of support industries of the electronic information industry with the core of "chip, screen, intelligent device, core component, internet of things" in Chongqing. Chongqing has accelerated industrial transformation, and focuses on the innovative development of IC industry, so it urgently needs the efficient cooperation between industrial chain and innovation chain. In this paper, the IC industry chain was divided into four core links, such as IC design, chip manufacturing, chip packaging and finished product testing. The six key elements of the innovation chain including scientific and technological talents, scientific research institutions, R & D platforms, Sci & Tech achievements, Sci & Tech enterprises and Sci & Tech projects were systematically analyzed. Based on the current situation of Chongqing IC industry, the problems still faced in the layout innovation chain were proposed, and the suggestions for further strengthening industrial innovation chain were put forward.
作者
冯梅
张磊
廖敏
李军锋
杨虹
王斌
FENG Mei;ZHANG Lei;LIAO Min;LI Junfeng;YANG Hong;WANG Bin(Chongqing Productivity Promotion Center,Chongqing 401147,P.R.China;College of Optoelectronic Engineering,Chongqing Univ.of Posts and Telecommunications,Chongqing 400065,P.R.China)
出处
《微电子学》
CAS
北大核心
2020年第6期868-874,共7页
Microelectronics
基金
重庆市科技计划项目(cstc2018jxjl120006)
重庆市高等教育教学改革研究重大项目(191045)。
关键词
集成电路
产业创新链
协同创新
integrated circuit
industrial-innovation chain
collaborative innovation
