摘要
单晶铜以其优异的电热学特性和机械特性而成为键合丝的首选线材。退火处理是键合丝生产的关键工艺,本文对单晶铜在退火过程中的氧化特性进行了研究,探求了不同退火温度下单晶铜氧化增重率随退火时间的函数关系,并利用金相显微镜及SEM观察了单晶铜的组织变化,结合氧化过程氧化物形貌和成分进行了氧化机理研究。结果表明,退火温度越高,氧化速率越快;氧化初期,氧化增重率变化不明显,随氧化时间延长,氧化增重率与之呈线性关系。单晶铜的氧化膜成分为Cu2O和CuO,氧化过程以化学反应为主,同时伴随着物理运动,二者相互作用促进了单晶铜的氧化。
Single crystal copper has become the preferred wire for bonding wire with excellent electro-thermal and mechanical properties.Annealing treatment is the key process of bonding wire production.In this paper,the oxidation characteristics of single crystal copper in the annealing process were studied,and the functional relationship between the oxidation weight gain rate of single crystal copper and annealing time at different annealing temperatures was explored.The microstructure changes of single crystal copper were observed by metallographic microscope and SEM,and the oxidation mechanism was studied combined with the oxide morphology and composition in the oxidation process.The result show that the higher the annealing temperature is,the faster the oxidation rate is;the oxidation weight gain rate does not change significantly at the initial stage,while the oxidation weight gain rate has a linear relationship with the extension of oxidation time.The composition of the oxide film of single crystal copper is Cu2 o and CuO.The oxidation process is mainly chemical reaction accompanied by physical movement.The two-way interaction promotes the oxidation of single crystal copper.
作者
秦茶
桑德利
梁博
段康
Qin Cha;Sang Deli;Liang Bo;Duan Kang(School of Materials Science and Engineering,Shijiazhuang Railway University,Shijiazhuang,Hebei,050043;Shijiazhuang Jingyu Metal Materials Co.,Ltd.,Shijiazhuang,Hebei,050000)
出处
《河北冶金》
2020年第12期14-19,34,共7页
Hebei Metallurgy
基金
藁城区科技研究与发展计划(编号:G201806)。
关键词
单晶铜
键合丝
退火
氧化增重率
CU2O
CUO
single crystal copper
bonding wire
annealing
oxidation weight gain rate
Cu2O
Cuo
