摘要
开发了温度场仿真计算软件用于电子设备环境舱高温(日照)、低温环境适应性论证与评估,适用于环境舱静止状态或运输状态。软件采用模块化设计,各模块通过数据文件进行数据交换。计算方法综合了集总参数法与CFD数值模拟的优点,将计算结果与数值模拟结果进行了对比。
Temperature Field Simulation Software is developed to evaluate the adaptability of electronic equipment climate chamber in high temperature(sun radiation)and low temperature environment,especially in steady state and transportation.The software modules use data files to exchange data.The simulation method combines the advantage of lumped parameter method and CFD method.Software computation results are compared with CFD results.
作者
于广锋
YU Guang-feng(AVIC CAPDI Integration Equipment Co.,Ltd.)
出处
《建筑热能通风空调》
2020年第10期60-62,共3页
Building Energy & Environment
关键词
温度场
仿真
集总参数法
temperature field
simulation
lumped parameter method
