摘要
制备“三明治”结构(铜引线-SAC305-铜引线)微焊点进行剪切试验,并利用ABAQUS软件模拟微焊点在剪切应力下的变形与失效现象。直径同为400μm、高度分别为125、225、325μm的微焊点,其剪切断裂强度分别为29.87、26.91、23.97 MPa。模拟结果与试验结果基本一致,焊点直径相同时,其高度越小则抗剪强度越强;钎料与铜引线界面处发生应力集中,最先出现裂纹,裂纹扩展而最终导致解理断裂。
The“Cu/Sn-3.0Ag-0.5Cu(SAC305)solder/Cu”sandwich structured micro-scale solder joints are prepared for shear test,and the deformation and failure of micro-scale solder joints under shear stress are simulated by ABAQUS software.The shear fracture strength of micro-scale solder joints with diameter of 400μm and height of 125μm,225μm and 325μm are 29.87,26.91 and 23.97 MPa,respectively.The simulation results are basically consistent with the experimental results.The smaller the height of solder joint is,the stronger the shear strength is.The stress concentration occurs at the interface between solder and copper lead,leading to cracks appearance,then crack propagation and eventually resulting in cleavage fracture.
作者
左存果
尹立孟
张中文
江山
苏子龙
张焱
姚宗湘
ZUO Cunguo;YIN Limeng;ZHANG Zhongwen;JIANG Shan;SU Zilong;ZHANG Yan;YAO Zongxiang(School of Metallurgy and Materials Engineering,Chongqing University of Science and Technology,Chongqing 401331,China)
出处
《重庆科技学院学报（自然科学版）》
CAS
2020年第5期107-111,共5页
Journal of Chongqing University of Science and Technology：Natural Sciences Edition
基金
国家自然科学基金项目“基于多次热循环的高级别管线钢焊接粗晶区的组织演变规律及增韧机理”(51674056)
重庆市研究生科研创新项目“Sn-Ag-Cu微焊点高温剪切蠕变失效行为研究及其有限元分析”(CYS19352)
国家级大学生创新训练计划项目“热-电耦合致铜核微焊点界面化合物演变及拉伸失效行为研究”(201911551005)。
关键词
电子封装
无铅钎料
微尺度焊点
剪切应力
断裂
electronic packaging
lead-free solder
micro-scale solder joint
shear stress
shear fracture
