摘要
文章从SMT与三维在线检测技术原理分析入手,论述了三维在线检测技术在SMT封装电路板中的应用。期望通过本文的研究能够对SMT封装电路板检测水平的提升有所帮助。
Based on the principle analysis of SMT and 3D on-line inspection technology,this paper discusses the application of 3D on-line detection technology in SMT packaged circuit board.It is expected that the research in this paper can help to improve the detection level of SMT packaged circuit board.
作者
李晓洁
李昭静
郭雷岗
Li Xiaojie;Li Zhaojing;Guo Leigang(Zhengzhou Electric Power College,Zhengzhou Henan,450000)
出处
《电子测试》
2020年第22期90-91,共2页
Electronic Test
