摘要
以Derwent Innovation数据库收录的专利文献为基础,本文研究了全球超快激光加工领域专利申请的整体态势、重点技术布局、区域布局和主要申请人竞争力,全面揭示了该领域的技术创新现状和竞争态势。研究发现:超快激光加工技术正处于快速发展阶段;激光器、控制系统和加工应用三个方向是研发热点;中、日、美、德既是主要技术来源地,又是主要的技术目标地;日、美、德重视全球专利技术布局,中国专利数量较多但大都集中于国内;日本爱信精机公司具有较强的专利实力,中国机构进入时间较晚,但发展较快。
Based on global patent data about ultrafast laser processing collected by Derwent Innovation database, annual distribution, major technology distribution, area distribution, the competitiveness of major assignees are analyzed, in order to reveal completely the technology innovation status and competitive situation of ultrafast laser processing technology. The conclusions of the study are given below: ultrafast laser processing technology is in the rapid development stage;laser units, control system and processing applications become the research and development hotspots;China, Japan, the United States and Germany are not only the main original countries, but also the main target countries;Japan, the United States and Germany attach importance to global patent technology layout, on the contrary, China has more patents compared to other countries but most of them are domestic applications;Aisin Seiki Co., Ltd. has strong patent strength, and Chinese institutions has entered this field late, but developed rapidly.
作者
许轶
许婧
XU Yi;XU Jing(Chengdu Library and Information Center,Chinese Academy of Sciences,Chengdu 610041)
出处
《中国发明与专利》
2020年第8期60-67,共8页
China Invention & Patent
基金
四川省科技计划软科学项目“基于政策工具视角的区域协同创新绩效评价与对策研究”(2019JDR0092)。
关键词
超快激光加工
微加工
竞争态势
专利分析
ultrafast laser processing
micro-processing
competitive situation
patent analysis
