摘要
文章对故障物理及可靠性物理技术进行了论述,根据故障物理分析方法重点介绍通过仿真方法和模型进行电子产品可靠性分析.在模型适用性分析的基础上,以某PCB板产品为例,通过热效应仿真分析和振动应力仿真分析的方法初步发现产品技术潜在问题,可为后续基于故障物理分析产品可靠性提供相应支撑和依据,展望以故障物理为基础的可靠性分析理论前景和未来应用.
In this paper,fault physics and reliability physics technology are discussed.According to the fault physics analysis method,simulation method and model are mainly introduced for reliability analysis of electronic products.On the basis of the applicability analysis of the model,taking a PCB product as an example,the potential technical problems of the product are initially found through the methods of thermal effect simulation analysis and vibration stress simulation analysis,which can provide the corresponding support and basis for the subsequent failure physical analysis of product reliability,and look forward to the theoretical prospect and future application of reliability analysis based on failure physics.
作者
陈胜坚
段桂环
李文禹
CHEN Shengjian;DUAN Guihuan;LI Wenyu(Guangzhou GRG Metrology&Test Co.,Ltd.,Guangzhou 510656,China;GRG Metrology&Test(Wuhan)Co.,Ltd.,Wuhan 430070,China)
出处
《现代信息科技》
2020年第8期47-50,共4页
Modern Information Technology
关键词
故障物理
可靠性
仿真分析
failure physics
reliability
simulation analysis
