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压接型IGBT在MMC系统中的电热耦合仿真 被引量:6

Electro-Thermal Coupling Simulation of Press-Pack IGBT in MMC System
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摘要 目前已知的高压柔性直流输电工程中的电压源换流器(voltage source converter,VSC)大多采用模块化多电平换流器(modular multi-level converter,MMC),MMC子模块中半桥子模块的应用最为广泛。高压直流输电系统的高可靠性要求半桥子模块的搭建必须采用压接型的绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)。本文主要针对压接型IGBT半桥模块的MMC展开电热耦合的仿真,探索出一种基于Foster热网络的电热耦合仿真方法,从热稳定性的角度对MMC系统的安全运行域进行了刻画。 At present,most voltage source converters(VSC)in known VSC-HVDC projects adopt modular multi-level converter(MMC).Among the MMC sub-modules,half-bridge sub-module is most widely used.The high reliability of HVDC transmission system requires the construction of half-bridge sub-modules to adopt press-pack insulated gate bipolar transistor IGBT.In this paper,the electro-thermal coupling simulation of the press-pack IGBT half-bridge module MMC is carried out,and an electro-thermal coupling simulation method based on Foster thermal network is explored.The safe operation domain of MMC system is described from the perspective of thermal stability.
作者 侯婷 苟浪中 李岩 何智鹏 姬煜轲 马定坤 王见鹏 王来利 HOU Ting;GOU Langzhong;LI Yan;HE Zhipeng;JI Yuke;MA Dingkun;WANG Jianpeng;WANG Laili(Electric Power Research Institute,CSG,Guangzhou 510663,China;Xi an Jiaotong University,Xi an 710049,China)
出处 《南方电网技术》 CSCD 北大核心 2020年第5期28-36,共9页 Southern Power System Technology
基金 南方电网公司科技项目(ZBKJXM20180046)。
关键词 压接型IGBT MMC 电热耦合 Foster热网络 press-pack IGBT MMC electro-thermal coupling Foster thermal network
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