摘要
研究了一种用于晶圆级封装中玻璃晶圆介电常数提取的方法。通过在玻璃晶圆上利用晶圆级再布线技术,实现谐振环电路的制作,利用射频毫米波探针台完成S参数的测量,最后通过仿真曲线与实测曲线的拟合完成玻璃晶圆相对介电常数的提取。结果表明,在10~60 GHz频段内,玻璃晶圆的介电常数随着频率的升高而降低,在60 GHz时相对介电常数值约等于6.4。利用提取的结果,完成了一款单极子毫米波天线的设计和制作,实测结果显示天线中心频点、带宽与设计值保持一致,验证了文中采用的介电常数提取方法的有效性。
A method for extracting the relative dielectric constant of glass wafers in wafer-level packaging was investigated.By using Redistribution Layer(RDL)technology,the resonant loop circuit was achieved on glass wafers.The S-parameters were measured using RF millimeter-wave probe stations.Finally,the relative dielectric constant of glass wafers was extracted by fitting the simulation curves with measured curves.The results show that the relative dielectric constant of glass wafers decreases with increasing frequency from 10 GHz to 60 GHz,and the relative dielectric constant is about 6.4 at 60 GHz.Using the extracted results,a monopole antenna was designed and fabricated.The actual measurement results show that the center frequency and bandwidth of the antenna are consistent with the design,indicating the effectiveness of the method.
作者
王波
夏晨辉
WANG Bo;XIA Chenhui(The 58th Research Institute of CETC,Wuxi 214035,Jiangsu Province,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2020年第6期97-102,共6页
Electronic Components And Materials
关键词
介电常数
玻璃
晶圆级封装
毫米波
谐振环
再布线
dielectric constant
glass
wafer-level packaging
millimeter wave
resonant loop
RDL
