摘要
The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were investigated.The preparation mechanism was also studied.The microstructure of samples was analyzed by XRD,SEM,EDS,TEM and HRTEM.The synergistic effect of PEG and SDS made the WC−Cu composite more compact during the electroplating process.The hardness of WC−Cu composites increased with the increase in WC content,while the electrical conductivity decreased with the increase in WC content.The density of samples tended to increase initially and then decreased with increase in the additive content.When the electroplating solution contained 10 g/L WC nanopowder,0.2 g/L PEG and 0.1 g/L SDS,the WC−Cu composite exhibited hardness of HV 221 and electric conductivity of 53.7 MS/m.Therefore,the results suggest that WC−Cu composite with excellent properties can be obtained by optimizing the content of additives and WC particles.
研究添加剂(聚乙二醇(PEG)、十二烷基硫酸钠(SDS))和纳米WC粉对WC-Cu复合材料显微结构、相对密度、硬度和导电性的影响,并对电镀制备机理进行研究。采用XRD、SEM、EDS、TEM、HRTEM等测试方法分析样品的显微结构。PEG与SDS的协同作用使WC-Cu复合材料在电镀过程中更加致密。WC-Cu复合材料的硬度随着WC含量的增加而增加,导电性随WC含量的增加而降低。随着添加剂含量的增加,样品的密度呈现先增大后减小的趋势。当电镀液中含有10 g/L WC纳米粉、0.2 g/L PEG和0.1 g/L SDS时,WC-Cu复合材料硬度为HV 221、电导率为53.7 MS/m。结果表明,通过优化添加剂和纳米WC颗粒的含量,可以得到性能优良的WC-Cu复合材料。
