摘要
为了控制微波密封电路壳体中的氢含量,降低氢致失效概率,提升电路的可靠性,研究了应用吸氢材料吸收电路封装内的氢的方式。通过分析选取了合适的吸氢材料和用量,并结合试验和对比确定了采用导电胶粘接的安装方式将其固定在电路外壳内侧。通过一系列的激发试验和模拟应用试验验证得出,适当地使用该吸氢材料可以可靠地吸收微波密封壳体中的大部分氢。该研究对于提高微波密封电路的可靠性具有一定的指导意义。
In order to control the hydrogen content in the microwave sealed circuit shell, reduce the probability of hydrogen failure, and improving the reliability of the circuit, the method of using hydrogen absorbing material to absorb hydrogen in circuit package is studied. Through analysis, the appropriate hydrogen absorbing materials and amounts are selected, and through test and comparison, it is determined that it should be fixed to the inside of the circuit case by means of conductive adhesive. Through a series of excitation tests and simulation application tests, it can be concluded that most of the hydrogen in the microwave sealed shell can be reliably absorbed by using the hydrogen absorbing material properly. This research has certain guiding significance for improving the reliability of microwave sealed circuit.
作者
何婷
敖冬飞
史广芹
文平
华熙
董作典
HE Ting;AO Dongfei;SHI Guangqin;WEN Ping;HUA Xi;DONG Zoudian(Xi’an Institute of Space Radio Technology,Xi’an 710100,China;Nanjing Electronic Devices Institute,Nanjing 210016,China)
出处
《电子产品可靠性与环境试验》
2020年第2期72-77,共6页
Electronic Product Reliability and Environmental Testing
关键词
吸氢材料
密封壳体
应用验证
导电胶粘接
hydrogen absorbing material
sealed shell
application verification
conductive adhesive bonding
