摘要
从LED芯片、LED荧光粉两个方面入手,综述了当前多种LED灯泡光热耦合理论与模型的研究进展,并且对研究方法进行评述,展望了LED灯泡光热耦合的进一步研究方向,对实际研究和应用具有一定作用。
The research progress of light thermal coupling theory and current model of various LED light bulbs was summarized from the perspectives of LED chip and LED phosphor,and the research methods were reviewed.The research prospect of light and heat coupling of LED light bulbs was discussed,which would exert a positive effect on practical research and application.
作者
陈跃
邹军
石明明
杨磊
杨忠
汤雄
徐慧
李超
陈狄飞
CHEN Yue;ZOU JUN;SHI Mingming;YANG Lei;YANG Zhong;TANG Xiong;XU Hui;LI Chao;CHEN Difei(School of Sciences,Shanghai Insititute of Technology,Shanghai 201418,China;Zhejiang Emitting Optoelectronic Technology Co.,Ltd.,Jiaxing 314100,Zhejiang,China;Shanghai Homelite Technology Co.,Ltd.,Shanghai 201601,China;Shanghai Lite-Way Lighting Appliance Co.,Ltd.,Shanghai 200127,China;Shaoyang Liangmei Lighting New Technology Co.,Ltd.,Shaoyang 422000,Hunan,China;Hangzhou Shilan Azure Co.,Ltd.,Hangzhou 310018,China;Zhejiang Meike Electric Co.,Ltd.,Shaoxing 312300,Zhejiang,China)
出处
《应用技术学报》
2020年第1期52-58,共7页
Journal of Technology
基金
国家自然科学基金(51902203)资助。
关键词
LED灯泡
光热耦合
荧光粉
LED芯片
LED light
optic-thermal coupling
fluorescent powder
LED chip
