摘要
当今世界信息化进程日新月异,化合物半导体由于它独特的特性而得到快速的发展,已成为现代信息技术的基础材料。本文详细阐述了半导体材料发展历程、分类,第二代、第三代化合物半导体特性及封装工艺控制。讨论对比了不同化合物半导体材料差异与性能优缺点、应用领域和发展前景。从环保安全、工艺应用、工艺控制、封装材料选用等方面总结了化合物半导体封装工艺控制的关键要求。
With the rapid development of information technology in the world today,compound semiconductors have developed rapidly due to their unique characteristics and have become the basic materials of modern information technology.This paper elaborates on the development history,classification,second-and third-generation compound semiconductor characteristics and packaging process control of semiconductor materials.The discussion compares the advantages and disadvantages of different compound semiconductor materials and their application fields and development prospects.The key requirements of compound semiconductor assembly process control are summarized from the aspects of environmental protection safety,process application,process control and assembly material selection.
作者
周金成
朱光远
李习周
ZHOU Jin-cheng;ZHU Guang-yuan;LI Xi-zhou(TianshuiHuaTian Technology Co.,Ltd,Tian shui 741000,China)
出处
《中国集成电路》
2020年第1期69-74,76,共7页
China lntegrated Circuit
