摘要
介绍了我国胶粘剂工业的现状以及胶接技术的应用进展,分析了当前我国在胶种的研究中出现的问题以及现状,并对胶种今后的发展方向进行了分析和预测。
The current situation of adhesive industry in China and the application progress of bonding technology are introduced.This paper analyzes the problems and current situation in the research of rubber seed in China,and makes analysis and prediction for the future development direction of rubber seed.
作者
李翠翠
王延召
王延琴
Li Cuicui;Wang Yanzhao;Wang Yanqin(Zhengzhou Airport Equipment Co.,Ltd.Physical and Chemical Measurement Center,Zhengzhou Henan 450000,China)
出处
《工程与试验》
2019年第4期111-112,共2页
Engineering and Test
关键词
胶粘剂
胶接
现状
应用前景
adhesive
bonding
current situation
application prospect
