摘要
对一种功率运算放大器的失效问题进行了研究并分析了失效机理。功率运算放大器在测试时发生失效,同时,-20 V供电电源电压在加电过程中存在波动。通过内部目检发现失效芯片内部驱动晶体管及相连的金属均存在过流烧毁形貌。对失效功率运算放大器和良好功率运算放大器进行红外热成像分析,失效器件的温升总体比台温高10℃。通过失效分析,供电电源发生快速突跳导致了功率运算放大器内的晶体管在导通和关断之间快速切换形成热量累积效应,从而导致器件烧毁,造成功率运算放大器过流失效。对电源输出波形异常原因进行分析,电源限流过小导致电源电压降低,从而造成加电时快速突跳。最后,搭建测试电路对功率运算放大器进行复现实验,进一步证明了器件的失效机理。
The failure problem of a power operational amplifier was studied and the failure mechanism was analyzed.The power operational amplifier failed during the test,and the-20 V supply voltage fluctuated during power-on process.Through the internal inspection,it was found that the driving transistor and the connected metal inside the failure chip have over current burnout appearance.Infrared thermal imaging analysis of the failure power operational amplifier and the good power operational amplifier was carried out,which demonstrated that the total temperature raise of the failure device was 10℃higher than that of the test machine.Based on the failure analysis,the failure of the power operational amplifier was caused by fast hop of the supply power.The fast hop caused fast switching of the transistor of the power operational amplifier,forming heat accumulation that was the reason of the burnout.The abnormal reason of the power output waveform was analyzed,the fast hop of the supply power when power-on was caused by the decrease of the voltage that was resulted from unreasonable current limit.Finally,the repetition test was applied based on the test circuit,the failure mechanism of the power operational amplifier was further proved.
作者
廉鹏飞
孔泽斌
陈倩
杨洋
李娟
祝伟明
楼建设
王昆黍
Lian Pengfei;Kong Zebin;Chen Qian;Yang Yang;Li Juan;Zhu Weiming;Lou Jianshe;Wang Kunshu(No.808 Institute,Shanghai Academy of Spaceflight Technology,Shanghai 201109,China;No.803 Institute,Shanghai Academy of Spaceflight Technology,Shanghai 201109,China)
出处
《半导体技术》
CAS
北大核心
2020年第1期77-83,共7页
Semiconductor Technology
基金
预先研究项目(050401)
关键词
功率运算放大器
失效分析
电源
过流
限流
power operational amplifier
failure analysis
power
over current
current limit
