摘要
电场诱导压印技术的关键在于能实现压印光刻胶的正向复形,对电场诱导模具的制备提出了较大的挑战。提出一种基于光刻、刻蚀和SU-8胶套刻的方法,实现了电场诱导压印模具的制备,通过Comsol仿真分析了电场分布,设计了支架高度与模具微结构高度,展示了几种不同形状、尺寸的模具结构,并对结构进行了表征。基于电场诱导模具搭建了试验平台,并在导电模具和基材之间施加电场,通过SEM观察成形结果得到,该结果与预计的电场诱导压印复制结构相似,验证了电场诱导套刻模具的适用性。
The key technology of electric field induced lithography is to realize the positive replica of photoresist,which poses a great challenge to the preparation of electric field induced imprinting mold.In this paper,a method based on photolithography,etching and SU-8 photoresist overlapping is proposed to realize the preparation of electric field induced imprinting mold.Through the simulation of Comsol,the electric field distribution was analyzed,and the height of spacers and mold microstructure were designed.In this paper,several kinds of mold structures with different shapes and sizes were shown and characterized.A test platform was built based on the electric field induced mold,and the electric field was applied between the conductive mold and the substrate.The forming results were observed by SEM.The results were similar to the predicted electric field induced imprinting replication structure,verifying the applicability of the electric field induced mold.
作者
黎相孟
田洪淼
祝锡晶
LI Xiangmeng;TIAN Hongmiao;ZHU Xijing(Shanxi Provincial Key Laboratory of Advanced Manufacturing Technology,School of Mechanical Engineering,North University of China,Taiyuan 030051,China;State Key Laboratory for Manufacturing System Engineering,School of Mechanical Engineering,Xi'an Jiaotong University,Xi'an 710049,China)
出处
《电加工与模具》
2020年第1期70-74,共5页
Electromachining & Mould
基金
国家自然科学基金资助项目(51705479)
山西省青年科技研究基金资助项目(201701D001128)
关键词
电场诱导
压印模具
紫外光刻
套刻
等离子体刻蚀
electric field induction
imprinting mold
ultraviolet photolithography
overlapping
plasma etching
