摘要
由于传统航空功率模块中大面积基板连接采用锡铅焊料,可靠性不佳,本文采用烧结银进行大面积基板连接,研究了接头的力学性能、断裂模式和显微组织。结果表明:接头力学性能良好,平均剪切强度为45.18 MPa,呈现出内聚失效和韧性断裂模式,粘接层的孔隙率为4.82%,显微结构致密均匀,界面结合良好。改进的大面积烧结银工艺只需印刷一次焊膏,采用快速升温速率提高烧结银致密度,并将烧结压力降至2 MPa,可以满足航天功率模块中基板连接的要求。
In traditional aerospace power modules,tin-lead solder with poor reliability is used for large-area substrate connections.In this work,sintered silver is used to join the large-area substrates.The mechanical properties,fracture mode and microstructure of large-area sintered silver joints are studied.The results show that the mechanical properties of the joints are good,and the average shear strength of the sample is 45.18 MPa,showing a cohesive failure and ductile fracture mode.No defects such as voids,cracks or delamination are found in the sintered silver bond-line.The microstructure of the bond-line is dense and uniform with a porosity of 4.82%.It is shown that the improved large-area sintered silver process requires only single printing.By increasing the heating rate to enhance the density of sintered silver and reducing sintering pressure to 2 MPa,the modified process can meet the requirements of substrate bonding in aerospace power modules.
作者
姜涵宁
李欣
梅云辉
JIANG Hanning;LI Xin;MEI Yunhui(School of Materials Science and Engineering,Tianjin University,Tianjin 300350)
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2019年第6期91-94,共4页
Aerospace Materials & Technology
基金
国家自然科学基金《裸铜基大功率IGBT器件的无铅烧结型界面及其服役可靠性研究》(51401145)
关键词
低温烧结银
大面积烧结
单层印刷
基板连接
Low temperature sintering silver
Large-area sintering
Single-printed
Substrate bonding
