3Peng. X. F,Wang. B. X. Forced convection and flow boiling heat transfer for liquid flowing through micro-channels [J]. Int. J. HeatMassTransfer, 1993,36:3421-3427. 被引量:1
4Tuckerman. D.B. Heat transfer microstructure for integrated circuits[D]. Lawrence Livermore National Laboratory, UCRL-53515, 1984. 被引量:1