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钴-钨/多孔铜镀层的电沉积与析氢性能 被引量:5

Electrodeposition and hydrogen evolution property of cobalt–tungsten/porous copper coating
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摘要 利用恒电流电沉积技术,首先通过“气泡模板”辅助在纯Ti片表面沉积多孔Cu,再沉积Co–W合金,获得了Co–W/多孔Cu镀层。经过电化学测试发现:该Co–W/多孔Cu镀层在1 mol/L NaOH溶液中展现出优异的析氢反应活性,其析氢反应动力学过程受Heyrovsky反应步骤控制。在较高的阴极过电位下,Co–W/多孔Cu镀层的阴极电流密度可超越金属铂片。所获得的样品中,W含量为17.2%(质量分数)左右的样品具有最强的析氢反应活性,其表观交换电流密度为1.62×10^-4 A/cm^2。 The porous Cu was deposited on the surface of pure Ti by galvanostatic electrodeposition with an auxiliary“bubble template”.The Co–W alloy was then electrodeposited on the surface of porous Cu also by galvanostatic electrodeposition.The electrochemical test results showed that the Co–W/porous Cu coatings exhibited good electrocatalytic activity for hydrogen evolution reaction(HER)in 1 mol/L NaOH solution.The kinetic process of HER on the surface of Co–W/porous Cu coating is controlled by the Heyrovsky reaction step.The cathodic current density of the Co–W/porous Cu coating exceeds that of metal Pt sheet when the potential is applied at relatively high cathodic overpotential.The P4 coating with a W content of^17.2wt.%showed the best HER activity and its apparent exchange current density was calculated to be 1.62×10^-4 A/cm^2.
作者 王星懿 王玉 盛敏奇 WANG Xing-yi;WANG Yu;SHENG Min-qi(Shagang School of Iron and Steel,Soochow University,Suzhou 215021,China)
出处 《电镀与涂饰》 CAS CSCD 北大核心 2019年第17期942-947,共6页 Electroplating & Finishing
基金 国家重点研发计划(2018YFE0306105) 江苏省大学生创新创业训练计划(201610285107H)
关键词 多孔铜 钴-钨合金 恒电流电沉积 析氢反应 porous copper cobalt–tungsten alloy galvanostatic electrodeposition hydrogen evolution reaction
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