摘要
通过正交试验设计方法研究了不同工艺因素对金凸点超声热压倒装焊的影响效果。结果表明,超声功率与压力的交互作用对倒装焊后的剪切力没有显著影响,且不同因素对倒装焊后剪切力的影响效果的排序为:压力>超声功率>温度>超声时间,结合凸点形变量以及不同因素显著性的讨论得出最优条件组合,且通过试验验证达到了预测的估计值。
The effects of different technical factors on thermosonic flip-chip bonding were studied by design of orthogonal experiments. The results show that the interaction between ultrasonic power and pressure has no significant effect on shear strength after flip-chip bonding. The order of effect of different factors on shear strength is: pressure> ultrasonic power>temperature>ultrasonic time. Based on bump deformation and the effect of different factors, the optimal parameters was obtained, and the experiment results were consistent with the predicted results.
作者
杨彦锋
徐达
常青松
张延青
祁广峰
YANG Yanfeng;XU Da;CHANG Qingsong;ZHANG Yanqing;QI Guangfeng(The 13th Research Institute, China Electronics Technology Group Corporation, Shijiazhuang 050051, China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2019年第9期105-109,共5页
Electronic Components And Materials
关键词
超声热压倒装焊
正交试验设计
压力
超声功率
交互作用
thermosonic flip-chip bonding
design of orthogonal experiments
pressure
ultrasonic power
interaction
