摘要
柔性电路的制作是柔性集成电路制作的前提条件,如何在低成本、高效率的条件下完成电路制备的工艺流程一直被优化和探寻.通过将微喷技术和传统的镀铜方法相结合的模式,在基体制造催化点实现铜线的依附,完成柔性电路的制备.这种方法可以极大地降低耗材,避免墨水与基体接触产生污染,效率很高.同时解决了较为常见的打印结合力不强的问题.具体流程中包括了对聚酰亚胺薄膜预处理.其次使用微喷技术,将硝酸银墨水以按滴喷墨的方式绘制电路图形,最后将薄膜放入镀铜液中发生置换反应生成铜线.所成型的电路可以代替普通线路接替在电路中正常运作.同时对影响阻值变化的不同参数(溶液浓度、温度、时间等)进行研究.
The manufacture of flexible circuit is the first step for the manufacture of flexible integrated circuit. How to complete the manufacture of circuit between the condition of low cost and high efficiency has been optimized and explored. By combining micro-jet with traditional copper plating method,the copper wire could be attached to the substrate at the catalytic point,and the flexible circuit could be prepared. This method could greatly reduce consumable material,avoid ink and matrix contact pollution, and it has high efficiency. At the same time,the problem of weak binding force was solved. The specific process includes the pretreatment of polyimide film. Secondly,micro-jet was used to draw circuit diagram of silver nitrate ink in the manner of drip inkjet. Finally,the film was put into the copper plating solution for substitution reaction to generate copper wire. The formed circuit could replace the ordinary circuit to take over the normal operation in the circuit. At the same time,different parameters (solution concentration, temperature,time,etc.) which affect the change of resistance value were studied.
作者
金文涛
孙怀远
王书平
尧宛辰
Jin Wentao;Sun Huaiyuan;Wang Shuping;Yao Wanchen(School of Medical Instrumentation and Food Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China;Shanghai University of Medicine & Health Sciences,Shanghai 201318,China;Institute 53,China North Industries Group Corporation,Jinan 250031,China)
出处
《工程塑料应用》
CAS
CSCD
北大核心
2019年第9期82-86,共5页
Engineering Plastics Application
关键词
微喷
柔性电路
镀铜
聚酰亚胺
micro-jet
flexible circuit
copper plating method
polyimide
