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Integrated spoof plasmonic circuits 被引量:5

Integrated spoof plasmonic circuits
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摘要 Using a metamaterial consisting of metals with subwavelength surface patterning, one can mimic surface plasmon polaritons(SPPs) and achieve surface waves with subwavelength confinement at microwave and terahertz frequencies, thus bringing most of the advantages associated with the optical SPPs to lower frequencies. Due to the properties of strong field confinement and high local field intensity, spoof SPPs have demonstrated the improved performance for data transmission and device miniaturization in an intensively integrated environment. The distinctive abilities, such as suppression of transmission loss and bending loss, and increase of signal integrity, make spoof SPPs a promising candidate for future generation of electronic circuits and electromagnetic systems. This article reviews the progress in spoof SPPs with a special focus on their applications in circuits from transmission lines to passive and active devices in microwave and terahertz regimes. The integration of versatile spoof SPP devices on a single platform,which is compatible with established electronic circuits, is also discussed. Using a metamaterial consisting of metals with subwavelength surface patterning, one can mimic surface plasmon polaritons(SPPs) and achieve surface waves with subwavelength confinement at microwave and terahertz frequencies, thus bringing most of the advantages associated with the optical SPPs to lower frequencies. Due to the properties of strong field confinement and high local field intensity, spoof SPPs have demonstrated the improved performance for data transmission and device miniaturization in an intensively integrated environment. The distinctive abilities, such as suppression of transmission loss and bending loss, and increase of signal integrity, make spoof SPPs a promising candidate for future generation of electronic circuits and electromagnetic systems. This article reviews the progress in spoof SPPs with a special focus on their applications in circuits from transmission lines to passive and active devices in microwave and terahertz regimes. The integration of versatile spoof SPP devices on a single platform,which is compatible with established electronic circuits, is also discussed.
出处 《Science Bulletin》 SCIE EI CAS CSCD 2019年第12期843-855,共13页 科学通报(英文版)
基金 supported in part from the National Natural Science Foundation of China(61871127,61735010,61631007,61571117,61501112,61501117,61522106,61722106,61701107,61701246 and 61701108) the Fundamental Research Funds for the Central Universities(2242018R30001) National Key Research and Development Program of China(2017YFA0700201,2017YFA0700202,and 2017YFA0700203) the 111 Project(111-2-05)
关键词 Spoof surface PLASMONS METAMATERIAL ELECTROMAGNETIC system INTEGRATED CIRCUITS Spoof surface plasmons Metamaterial Electromagnetic system Integrated circuits
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