摘要
采用磁控共溅射法在Cu箔上制备了Sn-Cu复合薄膜材料,探究了Cu靶的溅射功率对Sn-Cu复合薄膜材料电化学性能的影响。研究发现,当Cu靶的溅射功率为25W和充放电电流为120mA/g时,Sn-Cu复合薄膜材料的首周充电容量约为720mAh/g,首周库仑效率为77.9%。当充放电电流密度为300mA/g时,其充电比容量高达654.9mAh/g,100周循环后,仍可以维持在348.3mAh/g,容量保持率高达53.2%,具有较好的循环稳定性和优异的倍率性能。
Sn-Cu composite thin films were prepared by magnetron co-sputtering on Cu foil, and the influence of sputtering power of Cu target on electrochemical properties of Sn-Cu composite thin films was investigated. It was found that the charge capacity of Sn-Cu composite thin film material in the first cycle was about 720 mAh/g and the coulomb efficiency was 77.9% at the charge-discharge current of 120 mA/g, when the sputtering power of Cu was 25 W. When the current density of charge and discharge was 300 mA/g, its charge specific capacity was up to 654.9 mAh/g. After 100 cycles, it could still maintain at 348.3 mAh/g, and had a high capacity retention (53.2%). It had good cycling stability and excellent rate performance.
作者
白国梁
罗明
王春花
王钧伟
金石
朱雨婷
朱子洁
BAI Guoliang;LUO Ming;WANG Chunhua;WANG Junwei;JIN Shi;ZHU Yuting;ZHU Zijie(College of Chemistry and Chemical Engineering, Anqing Normal University, Anqing 246133, China)
出处
《安庆师范大学学报（自然科学版）》
2019年第2期91-94,共4页
Journal of Anqing Normal University(Natural Science Edition)
基金
安徽高校自然科学研究重点项目(KJ2018A0372)
安徽省级重点实验室开放基金(ZD2016005,K2017006)
