摘要
采用纯铝包套热压成型后真空烧结的方法制备了成分为Al-60wt.%Si的电子封装材料。研究了压制模具温度对材料显微组织、致密度、热导率以及热膨胀系数的影响。结果表明:压制模具温度为300℃时,烧结后铝基体形成半连续网格结构,合金内部孔洞较少;压制模具温度为350~450℃时,烧结后铝基体形成连续网格结构,合金内部孔洞逐渐增多,尺寸增大。当模具温度为350℃时,烧结后的合金物理性能较佳,烧结后合金的致密度和热导率分别为98.8%和115W/(m·K),室温-100℃、室温~150℃时的平均热膨胀系数分别为10.3×10^-6℃^-1和10.8×10^-6℃^-1。
An electronic packaging material with Al-60wt.%Si has been prepared by vacuum sintering after pure aluminum coating. The effect of pressing mold temperature on the microstructure, density, thermal conductivity and thermal expansion coefficient of the material has been investigated. The results show that when the temperature of the pressing mold is 300℃, the aluminum matrix forms a semi-continuous mesh structure after sintering, and the internal pores of the alloy are less. When the temperature of the pressing mold is 350~450℃, the aluminum matrix forms a continuous grid structure after sintering, and the internal pores of the alloy are more while the size increases. When the mold temperature is 350℃, the physical properties of the alloy after sintering are better. The density and thermal conductivity of the alloy after sintering are 98.8% and 115 W/m·K. The average coefficient of thermal expansion is respectively 10.3×10^-6℃^-1 and 10.8×10^-6℃^-1 when the temperature is respectively room temperatur -100℃ and room temperatur-150℃.
作者
黄海滨
冀恩龙
于宝义
郑黎
李润霞
HUANG Haibin;JI Enlong;YU Baoyi;ZHENG Li;LI Runxia(School of Materials Science and Engineering, Shenyang University of Technology, Shenyang 110870, Liaoning China;Dongguan Institute of Technology, Dongguan 523000, Guangdong China)
出处
《中国铸造装备与技术》
CAS
2019年第3期25-30,共6页
China Foundry Machinery & Technology
基金
国家自然科学基金(51674168)
辽宁省教育厅重点项目(201724112)
辽宁省创新人才支持计划项目(LR2017057)
关键词
电子封装材料
模具温度
热挤压
微观组织
致密度
热导率
热彭胀系数
Electronic packaging materials
Mould temperature
Hot pressing
Microstructure
pensity
Thermal conductivity
evefficident of thermal expansion
