摘要
全球晶圆代工的增长将保持稳定,但迁移到下一个节点将变得越来越困难和昂贵。预计到2018年,硅片代工业务将稳定增长,但这一增长会面临若干挑战。在最前沿,Global Foundries、英特尔、三星和台积电正从16 nm/14 nm向10 nm/7 nm节点迁移。据分析人士称,英特尔遭遇了一些困难,因为该芯片巨头最近宣布从2017年下半年到2018年上半年的新10 nm工艺的产能增加。时间会见证其他芯片制造商在向10 nm/7 nm迁移时会遭遇平滑还是硬过渡。
The silicon foundry business is expected to see steady growth in 2018,but that growth will come with several challenges.On the leading edge,GlobalFoundries,Intel,Samsung and TSMC are migrating from the 16 nm/14 nm to the 10 nm/7 nm logic nodes.Intel already has encountered some difficulties,as the chip giant recently pushed out the volume ramp of its new 10 nm process from the second half of 2017 to the first part of 2018,according to analysts.Time will tell if other chipmakers will have a smooth or rough transition at 10/7 nm.
作者
Mark LaPedus
Mark LaPedus(Taiwan Electronic Engineering album EE Times,China)
出处
《集成电路应用》
2018年第3期61-65,共5页
Application of IC
