摘要
At Techtextil,Degussa GmbH willpresent new grades in its range ofcopolyamide hotmelt adhesives,the newproduct is a low-melting copolyamidethat features improved adhesion to plas-tics like PVC,ABS and PC.It is plasti-cizer-resistant and particularly suitable fortemperature-sensitive applications.New cross-linkable and high-crystallinegrades complete the product portfolio.The materials are resistant to steam,willnot shrink or fade in hot-water laundrycycles or upon exposure to
