摘要
本文采用微米级铜粉为导电填料,抗坏血酸为还原剂,聚乙烯吡咯烷酮为分散剂,环氧树脂为基料,聚酰胺树脂为固化剂,制备获得空气中低温固化铜电子浆料。利用X射线衍射仪、金相显微镜、四探针电阻测试仪、粘度测试仪等对电子浆料各性能进行了表征。实验结果表明,当铜粉与有机载体的比例为85∶15时,在烘箱中75℃烘干得到的导电铜膜性能最佳,电阻率为3.627×10-3Ω·cm,空隙较少,样品表面较为平整,导电性较稳定。
Low temperature and air curing copper electronic pastes were prepared mainly by mixing micron-sized copper powders as conductive filler and epoxy resin as base material.Also added during the mixing were L-ascorbic acid,PVP and polyamide resin as reducing agent,dispersant and the curing agent,respectively.The performances of the electronic pastes were characterized by X-ray diffraction(XRD),metallographic microscope(OA),four point probe resistance tester and viscosity test.Results show that when the ratio of copper and organic carrier was 85∶15,and dryed at 75℃ in an oven,the conductive copper film exhibited the best performance:The resistivity was stable and reached 3.627#10-3Ω·cm;The sample had less porocity and smooth surface.
出处
《材料科学与工程学报》
CAS
CSCD
北大核心
2015年第6期908-911,共4页
Journal of Materials Science and Engineering
基金
陕西省教育厅自然专项资助项目(15JK1314)
纺织工业联合会科技指导性项目计划资助项目(2014005)
西安工程大学资助项目
关键词
铜电子浆料
有氧固化
抗氧化
电阻率
Copper electronic pastes
curing in oxygen
anti-oxidation
resistivity
