摘要
研究了纳米0.1%(质量分数)Al颗粒对SnAgCu无铅钎料与铜基板之间界面反应的影响,研究两种无铅钎料界面在-55~125℃热循环过程中的生长行为及其焊点力学性能变化。结果表明:随着热循环次数的增加,界面层金属间化合物的厚度明显增加,焊后界面层金属间化合物为Cu6Sn5相,在热循环过程中在Cu6Sn5和Cu基板之间出现Cu3Sn相。发现纳米Al颗粒的添加,界面层金属间化合物的厚度明显减少,纳米颗粒对界面层的生长具有明显的抑制作用。同时对焊点在热循环过程中的可靠性进行分析,发现焊点的拉伸力随着循环次数的增加逐渐降低,含纳米Al颗粒的焊点具有明显的优越性,在焊点服役期间,焊点失效路径为Cu6Sn5/Cu3Sn的界面处。
Effect of nano-Al particle on interface reaction between SnAgCu and Cu substrate was investigated,and interfacial layer growth of the two solders and mechanical properties of solder joints during-55-125℃thermal cycles were systematically analyzed.The results indicate that the intermetallic compounds grow obviously with the development of thermal cycles,Cu6Sn5IMCs are found at the assoldered interface,and Cu3Sn IMCs appears between Cu6Sn5and Cu substrate during thermal cycles. Moreover,it is found that the addition of nano-Al particles can reduce the thickness of intermetallic compounds layer,and nano-Al particles can retard the IMCs growth during thermal cycles.Finally, the reliability of solder joints during thermal cycles was studied,the tensile force decreases with the development of thermal cycles,and the SnAgCu solder joints bearing nano-particles exhibits improvements compared to SnAgCu.In service,the failure path of solder joints is observed between Cu6Sn5 and Cu3Sn phases.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2014年第3期55-59,共5页
Journal of Materials Engineering
基金
江苏省自然科学基金(BK2012144)
江苏科技大学先进焊接技术省级重点实验室开放研究基金(JSAWS-11-03)
江苏省高校自然科学基金(12KJB460005)
关键词
无铅钎料
界面反应
金属间化合物
失效路径
lead-free solder
interface reaction
intermetallic compound
failure path
