摘要
文章通过从原理上分析层压空洞产生的原因并结合缺陷板的分析。找出积层式多层印制电路板在半固化片压合铜箔过程中产生层压空洞缺陷的主要影响因素，包括基材区大小、基材区叠加、铜厚、半固化片树脂含量和升温速率与转压点等。通过正交试验优化升温速率、转压点、铜厚、和缓冲材料等关键参数，得到最终优化的控制方法：改善措施的实施后．使用低树脂含量的半固化片时的层压空洞缺陷率由改善前的76．5％降低至2％左右。并且呈现出持续改善的趋势。
The mechanism of lamination void was studied in this paper firstly. On the base of mechanism analysis and analyzing the defect boards secondly, the main influence factors for lamination void among pressing copper foil were found, which are the accumulation of no copper area, copper thickness, resin content, heating rate and pressure switch point and so on. Then several tests were designed to optimize the process parameters. The influence of heating rate, pressure switch point, copper thickness and cushioning material were mainly studied and optimized in this paper. After the corrective actions were implemented, the defect rate was reduced from 76.5% to 2% and had showed a trend of continuous decrease when the low resin prepreg was used. Kay words Build-Up Multilayer Board; Lamination Void; Low Resin Content; Heating Rate; Copper Thickness
作者
赵刚俊
王洪府
纪成光
Zhao Gangjun;Wang Hongfu;Ji Chengguang
出处
《印制电路信息》
2018年第A02期164-176,共13页
Printed Circuit Information
关键词
积层多层电路板
压合空洞
低树脂含量
升温速率
铜厚
Build-Up Multilayer Board
Lamination Void
Low Resin Content
Heating Rate
Copper Thickness
