摘要
真空树脂塞孔相比传统的树脂塞孔工艺，具有气泡少、塞孔饱满的优点，但是，在抽真空过程和释放真空的过程中。也会容易有孔口凹陷问题。文章采用力学原理对孔口凹陷产生原因进行分析，并挑选塞孔孔径等因素作为测试因子进行试验验证，最终使凹陷问题得到解决，极大提升了树脂塞孔良率。
With the development of micro assembly components and wiring area, the design of the PCB area also decreases continuously. In order to adapt to this trend, more and more PCB is designed with resin plugging process. Compared with non vacuum resin plugging, vacuum resin plugging has the advantage of less bubble and good plugging. However, during vacuum pumping process and vacuum release process, it is easy to produce the hole pit. In this paper, through the analysis of the mechanism of the two processes, starting from the improvement of tool, it solved the overall depression problem and greatly enhanced the yield of resin filling.
作者
张传超
刘艺文
梁春生
谢伦魁
王俊
Zhang Chuanchao;Liu Yiwen;Liang Chunsheng;Xie Lunkui;Wang Jun
出处
《印制电路信息》
2018年第A02期76-81,共6页
Printed Circuit Information
关键词
树脂塞孔
凹陷
真空
Resin Plugging
Pit
Vacuum
